| 发明名称 |
METHOD OF HEATING/COOLING A SUBSTRATE |
| 摘要 |
A method of heating/cooling one or more substrates includes placing the one or more substrates on a rotatable hot-cold plate, wherein each substrate of the one or more substrates is placed on a corresponding sub-plate of a plurality of sub-plates of the rotatable hot-cold plate. The method further includes rotating the one or more substrates, wherein rotating the one or more substrates comprises rotating each substrate of the one or more substrates independently. The method further includes heating or cooling the one or more substrates using a heating-cooling element, wherein rotating the one or more substrates comprises rotating the one or more substrates relative to the heating-cooling element. |
| 申请公布号 |
US2016183329(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201615058531 |
申请日期 |
2016.03.02 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
PENG Jui-Chun;CHUNG Jacky;LIU Heng-Hsin;LIN Chun-Hung |
| 分类号 |
H05B3/14;H05B1/02;H05B3/68 |
主分类号 |
H05B3/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of heating/cooling one or more substrates, the method comprises:
placing the one or more substrates on a rotatable hot-cold plate, wherein each substrate of the one or more substrates is placed on a corresponding sub-plate of a plurality of sub-plates of the rotatable hot-cold plate; rotating the one or more substrates, wherein rotating the one or more substrates comprises rotating each substrate of the one or more substrates independently; and heating or cooling the one or more substrates using a heating-cooling element, wherein rotating the one or more substrates comprises rotating the one or more substrates relative to the heating-cooling element. |
| 地址 |
Hsinchu TW |
