发明名称 Capacitor assembly
摘要 A capacitor assembly includes a semiconductor substrate having an interlayer insulation film on a first main surface of the semiconductor substrate, and a conductive barrier layer formed on the interlayer insulation film. The capacitor assembly also includes a contact plug electrically connected to the conductive barrier layer through the interlayer insulation film, and a lower electrode formed on the barrier layer. The capacitor assembly also includes a capacitor insulation film formed on the lower electrode, and an upper electrode formed on the capacitor insulation film. The capacitor insulation film is made from a ferroelectric material. The barrier layer is an amorphous film which includes titanium and aluminum.
申请公布号 US2007080388(A1) 申请公布日期 2007.04.12
申请号 US20060543782 申请日期 2006.10.06
申请人 INOMATA DAISUKE 发明人 INOMATA DAISUKE
分类号 H01L29/94 主分类号 H01L29/94
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