| 摘要 |
PROBLEM TO BE SOLVED: To enhance the durability of a semiconductor laser device using a semiconductor laser element having an oscillation wavelength of 500 nm or less. SOLUTION: When a semiconductor laser device 20 is manufactured before a cap 26 is attached to a stem 21; an inner face of the cap 26 which is located inside a package 28, the stem 21, a heat sink 22, and a semiconductor laser element 29 are irradiated by ultraviolet rays in a dry air atmosphere and heated. Next, the cap 26 is attached to the stem 21 in the dry air atmosphere, and the semiconductor laser element 29 is sealed in the package 28 together with a dry air. COPYRIGHT: (C)2007,JPO&INPIT
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