发明名称 SUBSTRATE OBSERVATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate observation device by which the detailed shape of a contact hole and its bottom can be measured. SOLUTION: The substrate observation device is provided with an electron source 21 which generates an electron beam; a deflector 22 which irradiates the surface of a substrate to be observed with the electron beam from the electron source 21, and allows the electron beam to scan the surface of the substrate; and a substrate current detection means which detects current from the substrate to a reference potential part of the device. In this case, it is also provided with an operation processing device 50 which extracts substrate current signals of the contact hole and those of the other parts from substrate current signals according to deflection signals of the deflector 22 and the detected substrate current signals, calculates their respective amounts of the current, and displays the shape of the contact hole. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007096224(A) 申请公布日期 2007.04.12
申请号 JP20050286917 申请日期 2005.09.30
申请人 TOPCON CORP 发明人 UENO KUSUO;YASUMA MASUO
分类号 H01L21/66;G01R31/302 主分类号 H01L21/66
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