发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of accurately controlling a flow rate of a treatment liquid overflowing out of a treatment tank. SOLUTION: The substrate treatment apparatus 1 is constituted of a treatment tank 10 equipped with a contact member 40 on its periphery. The contact member 40 is of a wedge shape converging downward and the gap between the treatment tank 10 and the contact member 40 varies according to an upward or a downward movement of the contact member 40. If the contact member 40 is caused to descend to contact a treatment liquid 9, the treatment liquid 9 flows out into an outer tank 12 along the contact member 40. The flow rate of the treatment liquid 9 is accurately controlled by adjusting the gap between the treatment tank 10 and the contact member 40. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007090217(A) 申请公布日期 2007.04.12
申请号 JP20050282140 申请日期 2005.09.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 ARAKI HIROYUKI;TOKURI KENTAROU
分类号 B08B3/04;H01L21/304;H01L21/306 主分类号 B08B3/04
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