发明名称 |
SUBSTRATE TREATMENT APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of accurately controlling a flow rate of a treatment liquid overflowing out of a treatment tank. SOLUTION: The substrate treatment apparatus 1 is constituted of a treatment tank 10 equipped with a contact member 40 on its periphery. The contact member 40 is of a wedge shape converging downward and the gap between the treatment tank 10 and the contact member 40 varies according to an upward or a downward movement of the contact member 40. If the contact member 40 is caused to descend to contact a treatment liquid 9, the treatment liquid 9 flows out into an outer tank 12 along the contact member 40. The flow rate of the treatment liquid 9 is accurately controlled by adjusting the gap between the treatment tank 10 and the contact member 40. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007090217(A) |
申请公布日期 |
2007.04.12 |
申请号 |
JP20050282140 |
申请日期 |
2005.09.28 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
ARAKI HIROYUKI;TOKURI KENTAROU |
分类号 |
B08B3/04;H01L21/304;H01L21/306 |
主分类号 |
B08B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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