发明名称 |
Semiconductor device and semiconductor device production method |
摘要 |
The present invention provides a semiconductor device in which the warp of a board is suppressed without the need for provision of a solder resist on opposite surfaces of the board and semiconductor element connection characteristics are improved by reducing stress exerted on a connection portion, and increases flexibility in assembly process.
|
申请公布号 |
US2007075415(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20060492918 |
申请日期 |
2006.07.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OSUMI TAKATOSHI |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|