| 摘要 |
A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by means of conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway. |
