发明名称 LEAD-FREE SOLDER
摘要 PROBLEM TO BE SOLVED: To provide a lead-free solder which is free from harmful substances and excellent in solderability. SOLUTION: The lead-free solder contains 30-60 wt.% zinc, 0.1-2 wt.% copper and the balance of tin, or contains 30-60 wt.% zinc, 0.1-2 wt.% copper, 0.1-1 wt.% nickel and the balance of tin. Either of the above-mentioned solders further may contain 0.01-0.5 wt.% aluminum. The invented solder is used for soldering electronic components or connecting fuse wires. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007075897(A) 申请公布日期 2007.03.29
申请号 JP20060289479 申请日期 2006.10.25
申请人 KOA CORP 发明人 KOBAYASHI HIROSHI;KATO KAZUYUKI
分类号 B23K35/26;B23K1/00;B23K101/36;C22C13/00 主分类号 B23K35/26
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