| 摘要 |
PROBLEM TO BE SOLVED: To more improve positioning accuracy among optical components than conventional technology. SOLUTION: Positioning for a first direction F1, second direction F2, and third direction F3 of a laser diode chip 5 is highly precisely performed by bringing a right side surface 5a and a front surface 5b of the laser diode chip 5 respectively into contact with a first positioning face 3a and a second positioning face 3b of a positioning structure 3. By mounting the laser diode chip 5 on the semiconductor substrate 2 in such a positioned state, it is possible to realize a semiconductor optical device on which the laser diode chip 5 is highly precisely positioned and mounted with respect to the foregoing three directions. Consequently, it is possible to more improve optical coupling efficiency between a microlens 4 and the laser diode chip 5 than conventional technology. COPYRIGHT: (C)2007,JPO&INPIT
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