| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment with heat dissipation structure which prevents the reduction in the efficiency of heat transfer, even if the height of the electronic components mounted in a substrate differs, as well as having easy processability. SOLUTION: The heat conduction junction of a heat-transfer object 31 is carried out as mounted in a first circuit substrate 11 and a heating material mounted in a second circuit substrate 41. Furthermore, the electric conductive connection of the first circuit substrate 11 and the heating material is carried out via the second circuit substrate 41, and a heat-transfer object 31 is an electronic device covered with a thermal insulation material 32 except the region wherein the electric conductive connection with the heating member is carried out. COPYRIGHT: (C)2007,JPO&INPIT |
