| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board provided with a reinforcing means for warpage prevention, which is made thin and suppresses warpage generation, and also to provide a method for manufacturing the multilayer wiring board. SOLUTION: In the multilayer wiring board made of a plurality of stacked layers, that is, wiring layers 105, 108, 110, 112, and insulating layers 104, 106, 107, 109, one or a plurality of reinforcing wiring layers 103 are provided having a thickness of 35-150μm. COPYRIGHT: (C)2007,JPO&INPIT |
