发明名称 Complex laminated chip element
摘要 The present invention relates to a laminated chip element which can be manufactured to have desired electric properties by combining various elements in accordance with the desired objectives. More particularly, the present invention relates to a laminated chip element which has superior high frequency properties and can be manufactured to control capacitance and/or inductance of the laminated chip element to a desired value. There is provided a laminated chip element, comprising at least one first sheet on which first and second conductive patterns are formed, the first and second conductive patterns being spaced apart from each other in a direction of both ends of the first sheet; and at least one second sheet on which a third conductive pattern is formed, the third conductive pattern being formed in a transverse direction of both the ends of the first sheet; wherein one ends of the first and second conductive patterns are connected to the first and second external terminals, respectively, at least one end of the third conductive pattern is connected to a third external terminal, and the first and second sheets are laminated. There is also provided a laminated chip element, comprising: at least one first sheet on which a conductive pattern is formed, the first conductive pattern consisting of first and third portions, the first and second portions being spaced apart from each other in a direction of both ends of the first sheet, the second portion connecting the first and second portions to each other to have a predetermined inductance; and at least one second sheet on which a conductive pattern is formed in a transverse direction of both the ends of the first sheet; wherein the first and second portions are connected to the first and second external terminals, respectively, at least one ends of the second conductive pattern is connected to a third external terminal, and the first and second sheets are laminated.
申请公布号 US2007063330(A1) 申请公布日期 2007.03.22
申请号 US20040566810 申请日期 2004.07.15
申请人 PARK IN-KIL;HWANG SOON-HA;KIM DUK-HEE 发明人 PARK IN-KIL;HWANG SOON-HA;KIM DUK-HEE
分类号 H01L23/02;H01C1/148;H01C7/00;H01C7/18;H01C13/02;H01F17/00;H01G4/232;H01G4/40;H01L27/02 主分类号 H01L23/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利