发明名称 SUBSTRATE PARTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate parting method ensuring the acquisition of smooth and high-quality parted surfaces. SOLUTION: Before parting a substrate 1 to be parted, crack proceeding direction constraining means 4 each of which constrains the proceeding direction of a crack C are formed at least at both ends of the scribe line SL forming part of the substrate 1 so that the crack C proceeding from the scribe line SL proceeds in the thickness direction of the substrate 1 during the parting of the substrate by a pressing member. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007062227(A) 申请公布日期 2007.03.15
申请号 JP20050252781 申请日期 2005.08.31
申请人 OPTREX CORP 发明人 TAKAGI MASAMI;HAMADA YASUYOSHI
分类号 B28D5/00;C03B33/033;C03B33/04;C03B33/07;G02F1/13;G02F1/1333;G09F9/00;H01L51/50;H05B33/10 主分类号 B28D5/00
代理机构 代理人
主权项
地址