发明名称 RELEASE FILM FOR PCB LAMINATION PROCESS
摘要 <p>Disclosed herein is a release film for PCB lamination processes, which is obtained by laminating a layer B, consisting of polypropylene (PP) resin, on one side of a layer A, consisting of either a film made of any one selected from the group consisting of polycarbonate (PC) resin, polybutylene terephthalate (PBT) resin, a mixed resin of polycarbonate (PC) and polybutylene terephthalate (PBT), a mixed resin of polycarbonate (PC) and polyethylene terephthalate (PET), a mixed resin of polybutylene terephthalate (PBT) and polyethylene terephthalate (PET), and a mixed resin of polycarbonate (PC), polybutylene terephthalate (PBT) and polyethylene terephthalate (PET), or a film made of polyethylene terephthalate (PET). The disclosed release film resists pressing process conditions of high temperature and high pressure and, at the same time, has excellent releasability from a polyimide film as a cover layer, and does not substantially transfer a material to PCB or the cover layer.</p>
申请公布号 WO2007029979(A1) 申请公布日期 2007.03.15
申请号 WO2006KR03567 申请日期 2006.09.07
申请人 KIM, SEONG-MIN 发明人 KIM, SEONG-MIN
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
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