发明名称 |
Comparing on die response and expected response applied to outputs |
摘要 |
A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.
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申请公布号 |
US7183789(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20040806546 |
申请日期 |
2004.03.23 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
WHETSEL LEE D. |
分类号 |
G01R31/26;G01R31/317;G01R31/3185;G01R31/319;G01R31/3193 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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