| 摘要 |
Disclosed is an acceleration sensor (10) wherein an acceleration sensor chip (20) whose lower surface is fixed onto a substrate (12) is sealed with a mold resin (22). In the acceleration sensor chip (20), a space wherein a plummet portion (28) swings in accordance with the acceleration applied thereto is hermetically sealed. A buffering member (24) is arranged between the mold resin (22) and the acceleration sensor chip (20) in such a manner that the buffering member (24) covers the lateral faces and upper surface of the acceleration sensor chip (20). |
