发明名称 INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS
摘要 An integrated liquid cooling system ( 100 ) includes a heat absorbing member ( 10 ), a heat dissipating member ( 20 ) and a pump ( 15 ). The heat absorbing member defines therein a fluid flow channel ( 115 ) for passage of a coolant. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the heat dissipating member and is maintained in fluid communication with the heat absorbing member and the heat dissipating member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The components (i.e., the heat absorbing member, the heat dissipating member and the pump) of the liquid cooling system are combined together to form an integrated structure without utilizing any separate connecting pipes.
申请公布号 US2007034353(A1) 申请公布日期 2007.02.15
申请号 US20060308278 申请日期 2006.03.15
申请人 LIU TAY-JIAN;YANG CHIH-HAO;TUNG CHAO-NIEN;HOU CHUEN-SHU 发明人 LIU TAY-JIAN;YANG CHIH-HAO;TUNG CHAO-NIEN;HOU CHUEN-SHU
分类号 H05K7/20 主分类号 H05K7/20
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