| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor for simplifying a conveyer in a manufacturing line while dramatically enhancing manufacturing work efficiency to reduce a manufacturing cost. SOLUTION: This semiconductor pressure sensor is equipped with a semiconductor sensor chip 1 for detecting a pressure, a processing circuit IC2 for correcting and amplifying an electrical signal from the sensor chip 1, a sub-package 5 comprising a terminal 5b electrically connected to the sensor chip 1 and to the processing circuit IC2 by means of a bonding wire 3, and a housing 4 integrated by insert-mold forming and provided outside the sub-package 5. In this pressure sensor, the sub-package 5 has a mounting surface 5d formed thereon to be mounted with the sensor chip 1 and the processing circuit IC2. COPYRIGHT: (C)2007,JPO&INPIT |
