SEMICONDUCTOR PACKAGE DRIVING BY OPTIC

摘要

A semiconductor package driven by light is provided to enhance the productivity of a packaging process by decreasing a wire connecting failure in a wire bonding process. A lead frame(110) consists of a die pad with a hole, an inner lead and an outer lead. A semiconductor chip(120) is bonded to a circuit surface of the die pad. The chip is selectively exposed to the outside through the hole of the die pad. A plurality of bonding pads are formed along a periphery of the chip. The size of the chip is larger than that of the die pad. The chip is driven by light. A wire(130) is used for connecting the bonding pad of the chip with the inner lead. An encapsulating resin(140) is used for encapsulating selectively the resultant structure.