| 摘要 |
A conductive silicone paste composition is provided to reduce displeasure and harmfulness without doing damage to established physical properties by using dimethylsiloxane oligomer instead of aromatic organic solvent. The conductive silicone paste composition comprises (a) 20-90 parts by weigh of conductive particles, (b) 10-80 parts by weight of ambient-temperature curable silicone resin, and (c) 0.1-20 parts by weight of siloxane-based oligomers. The siloxane-based oligomer is at least one selected from the group consisting of hexamethyldisiloxane, octamethyltrisiloxane, hexamethyl cyclosiloxane, decamethyltetrasiloxane, and octamethylcyclotetrasiloxane.
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