| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit substrate capable of preventing the separation of a metal support substrate by improving the adhesiveness of the metal support substrate with a simple configuration at the end rim of an opening formed on the metal support substrate. SOLUTION: In order to reduce the transmission loss of a conductor pattern 5 in a suspension substrate 1 with a circuit, a metal foil 6 buried in a base insulating layer 3 is formed as a pattern equipped with a first metal foil 9, and a second metal foil 10 surrounding the first metal foil 9 with a gap S1, while an opening unit 7 is formed on the metal support substrate 2 so that the opening end rim 8 thereof is arranged in the gap S1. COPYRIGHT: (C)2007,JPO&INPIT
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