| 摘要 |
A method of manufacturing a semiconductor device, including: providing a semiconductor substrate which has a plurality of electrodes and in which a depression is formed on a side on which the electrodes are formed; forming a resin protrusion on the semiconductor substrate so that part of the resin protrusion is positioned in the depression; and forming an interconnect on the resin protrusion, the interconnect being electrically connected to at least one of the electrodes. |
