Semiconductor package and the fabrication method thereof,申请号KR20000022156-传众专利搜索

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发明名称	Semiconductor package and the fabrication method thereof
摘要
申请公布号	KR100673938(B1)	申请公布日期	2007.01.24
申请号	KR20000022156	申请日期	2000.04.26
申请人		发明人
分类号	H01L23/16	主分类号	H01L23/16
代理机构		代理人
主权项
地址

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