发明名称 METHOD OF FORMING RESIST FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a less defective resist film by reliably and efficiently removing microcontamination causing micro defects in a resist liquid, and preventing fine bubbles from being produced. <P>SOLUTION: The method of forming a resist film by coating a board with a resist liquid after filtering the resist liquid at a filtering pressure of 9,500 Pa or less, using a high polymer material-made filter having a hole diameter of 0.02 &mu;m. This reliably and efficiently removes microcontamination in the resist liquid causing micro defects from which no problem arises in the prior art, prevents fine bubbles from being produced to lessen the defect of the resist film down to a required quantity of defects, and improves the yield of a resist film-coated product such as photo mask blank formed with the resist film and a work under process such as finely processed photo masks using the resist film. Thus, the resist film is formed efficiently by keeping the productivity of the resist film forming at a maximum with meeting the requirements of the resist film for lessening the defect. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007012974(A) 申请公布日期 2007.01.18
申请号 JP20050193565 申请日期 2005.07.01
申请人 SHIN ETSU CHEM CO LTD 发明人 WATANABE MASATAKA
分类号 H01L21/027;B01D61/14;B01D71/26;B05D3/00;G03F7/16 主分类号 H01L21/027
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