发明名称 Optical subassembly and projection objective in semiconductor lithography
摘要 An optical subassembly with an optical element, for example a mirror element ( 7 ), has an optical surface ( 9 ) and bearing points ( 12 ) arranged on the circumference. The optical element ( 7 ) is connected to a mount ( 13 ) at the bearing points ( 12 ) via connecting elements ( 14, 15, 16, 17, 18 ). Stress-decoupling cutouts, for example curved slots ( 11 ), are provided between the optical surface ( 9 ) and the bearing points ( 12 ).
申请公布号 US2007014037(A1) 申请公布日期 2007.01.18
申请号 US20060573216 申请日期 2006.03.24
申请人 FROMMEYER ANDREAS;MORRISON G F;KELLER WOLFGANG;KWAN YIM-BUN P;KIRCHNER HARALD;HEINTEL WILLI 发明人 FROMMEYER ANDREAS;MORRISON G. F.;KELLER WOLFGANG;KWAN YIM-BUN P.;KIRCHNER HARALD;HEINTEL WILLI
分类号 G02B7/02;G02B7/18;G02B7/182;G03F7/20 主分类号 G02B7/02
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