| 摘要 |
PROBLEM TO BE SOLVED: To improve heat transfer efficiency when heating a circuit board regarding the structure, or the like of spraying panel for spraying heated atmospheric gas to the circuit board in a nitrogen-furnace-type reflow furnace. SOLUTION: In the spraying panel for spraying the heated atmospheric gas to the circuit board, a prescribed value and a prescribed ratio are given to the arrangement of a plurality of blow-out holes provided in the panel and a plurality of suction holes, the total area ratio of the blow-out and suction holes, blow-out pressure from the blow-out holes, suction pressure from the suction holes, and the like, thus improving the heat transfer efficiency in the circuit board. COPYRIGHT: (C)2007,JPO&INPIT |
