| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate processing apparatus and substrate processing method which can prevent the occurrence of water marks when washing and drying a substrate and can also prevent the falling of a pattern formed on the substrate. SOLUTION: The substrate processing apparatus 1 includes a liquid processing tank 6 (inner tank 30) for treating a wafer W by dipping it in pure water stored therein, chamber 5 for drying the wafer W, wafer guide 4 for transferring the wafer W between the liquid processing tank 6 and the chamber 5, liquid nozzle 71 for supplying water vapor and IPA vapor to the chamber 5, and controlling portion 99 which controls the supply of the water vapor and the IPA vapor in such a way that the water vapor is supplied to the chamber 5 before the wafer W dipped in the pure water stored in the inner tank 30 is pulled up toward the chamber 5, and that after the wafer W is pulled up and stored in the chamber 5, the supply of the water vapor is stopped and then the supply of the IPA vapor is started. COPYRIGHT: (C)2007,JPO&INPIT
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