| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure bonding device of a substrate capable of improving a manufacturing yield and a productivity, and to provide a device for manufacturing a display unit using the substrate. SOLUTION: The pressure bonding device comprises a supporting part 410 for supporting a first substrate S1 and a second substrate S2 that is positioned to a connection part of the first substrate S1 through a connection member AD, a fixing mechanism 415 for fixing the first substrate S1 to the supporting part 410; a pressure buildup head 420 for pressurizing the second substrate S2 to the connection part of the first substrate S1 with the supporting part 410, and pressure bonding the second substrate S2 to the first substrate S1; a protective sheet 430 intervening between a pressurizing part WX for pressure bonding the second substrtate S2 to the first substrate S1 and the pressure buildup head 420, and a moving mechanism for relatively moving the protective sheet 430 from the pressurizing part WX to the second substrate S2 side when the pressure buildup head 420 is set apart from the supporting part 410. COPYRIGHT: (C)2007,JPO&INPIT
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