Method for forming and encapsulating of via hole,申请号KR20010001310-传众专利搜索

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发明名称	Method for forming and encapsulating of via hole
摘要
申请公布号	KR100666374(B1)	申请公布日期	2007.01.09
申请号	KR20010001310	申请日期	2001.01.10
申请人		发明人
分类号	H01L21/56;H01L21/28	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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