发明名称 |
LEITERBAHNENMATERIAL UND METHODE, LEITERPLATTEN UNTER VERWENDUNG DESSELBEN HERZUSTELLEN |
摘要 |
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles. <IMAGE> |
申请公布号 |
DE60032005(D1) |
申请公布日期 |
2007.01.04 |
申请号 |
DE2000632005 |
申请日期 |
2000.08.25 |
申请人 |
HITACHI CHEMICAL CO. LTD. |
发明人 |
FUJINAWA, TOHRU;YUSA, MASAMI;NOMURA, SATOYUKI;ONO, HIROSHI;WATANABE, ITSUO;ARIFUKU, MOTOHIRO;KANAZAWA, HOUKO |
分类号 |
C08J5/00;H05K3/32;C08F283/00;C08F290/06;C08G18/48;C08G18/66;C08G18/81;C08J3/20;C08L51/08;C08L75/04;C09J4/06;C09J9/02;C09J175/04 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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