| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor chip die-bonded to a substrate across a solder layer never cracks. <P>SOLUTION: The semiconductor device is equipped with the semiconductor chip 11 and the substrate 21 where the semiconductor chip 11 is die-bonded across the solder layer, and a beveled part 12 is formed at least at one of corners and edges, coming into contact with the solder layer 18, that the semiconductor chip 11 has. <P>COPYRIGHT: (C)2007,JPO&INPIT |
