| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing system and a processing method for effectively removing particles from a wafer, before being carried into a carrier or a wafer carried out of the carrier. SOLUTION: The processing system for processing a substrate W comprises a processing section for processing the substrate W; a mount table 40 for mounting a storage vessel C for storing a plurality of substrates W; and a substrate carrier 60 for carrying the substrates W into or out of the storage vessel C via an opening 20 in the storage vessel C, while holding the substrates W in a nearly horizontal attitude. Then, a gas supply port 73 for supplying gas to the substrates W held by the substrate carrier 60 in a direction of going from the side of the opening 20 to the outside of the opening 20. COPYRIGHT: (C)2007,JPO&INPIT
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