发明名称 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE MOUNTING PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To prevent a silver-plated layer surface serving as a light reflecting surface from discoloring for a long term in a manufacturing method of a light emitting device mounting package. <P>SOLUTION: After a silver-plated layer 20 is formed on a peripheral face of a cavity 13 of a package body 11, a light emitting device 12 is mounted on a device mounting region 24 in the cavity 13 via a sheetlike preform 23, and the light emitting device 12 is soldered onto the device mounting region 24. Thereafter, an electrode of the device 12 and the pad 15 are connected via a bonding wire 14. Then, the package body 11 (at least an entire surface of the silver-plated layer 20) is soaked in a solution of a silver discoloration inhibitor to form a silver discoloration preventive coat 21 on the surface of the layer 20. Thereafter, the package body 11 is taken out from the solution of the inhibitor, washed in water and dried. Thus, the entire surface of the silver-plated layer 20 to serve as the light reflecting surface 22 is coated with the transparent and thin silver discoloration preventive coat 21. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006351568(A) 申请公布日期 2006.12.28
申请号 JP20050171875 申请日期 2005.06.13
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 MURAKI ICHIRO
分类号 H01L33/60;H01L23/02;H01L33/62 主分类号 H01L33/60
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