The invention relates to an adhesive, particularly for gluing conductive materials, comprising at least one adhesive component and fillers. Said fillers contain fibers or fiber-powder mixtures, the fibers and/or the powders being made of an electrically conductive material. The invention further relates to a compound comprising a sputter target material and a carrier material with an adhesive.
申请公布号
WO2006136310(A2)
申请公布日期
2006.12.28
申请号
WO2006EP05652
申请日期
2006.06.13
申请人
W.C. HERAEUS GMBH;SIMONS, CHRISTOPH;SCHLOTT, MARTIN;PREISSLER, PETER;HEINDEL, JOSEF
发明人
SIMONS, CHRISTOPH;SCHLOTT, MARTIN;PREISSLER, PETER;HEINDEL, JOSEF