SEMICONDUCTOR CHIP PACKAGE AND DISPLAY DEVICE HAVING THE SAME

摘要

A semiconductor chip package and a display device having the same are provided to prevent deformation and defects of a flexible printed circuit board by improving a structure thereof. A plurality of first lead terminals are formed on a first side. A plurality of first drive signals are applied to the plurality of first lead terminals. A semiconductor chip is mounted on the first side and a second side extended from the first side to output second drive signals in response to the first drive signals. A plurality of second lead terminals(330-2) are formed on the second side and a third side extended from the second side to output second drive signals.