| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal-ceramic compound substrate having favorable heat dissipation properties, manufactured at a low cost and used for a substrate for an electronic circuit, and provide a manufacturing method of the same. <P>SOLUTION: A metal-ceramic compound substrate 10 comprises: a metal substrate 11; a ceramic layer 12 formed on the metal substrate 11; an electrode layer 13 formed on the ceramic layer 12; and a solder layer 14 formed on the electrode layer 13. The ceramic layer 12 comprises a ceramic thin film. The metal-ceramic compound substrate 10 with favorable heat dissipation properties is obtained by forming the ceramic layer 12 of an aluminum nitride thin film. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
