发明名称 PARTING METHOD FOR FRAGILE MATERIAL SUBSTRATE AND PARTING DEVICE USING THE METHOD
摘要 <p>The substrate made of the fragile material is scribed, after a protective element is applied onto a surface of the substrate. The cullet produced while cutting the substrate along the scribe line by forming a vertical crack extending deep into the substrate, is removed. An independent claim is also included for fragile substrate cutting device.</p>
申请公布号 KR100657201(B1) 申请公布日期 2006.12.13
申请号 KR20047013987 申请日期 2003.04.01
申请人 发明人
分类号 B28D5/00;C03B33/023;C03B33/033;C03B33/07;C03B33/10 主分类号 B28D5/00
代理机构 代理人
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