Method of manufacturing Surface-treated Copper Foil for PCB having fine-circuit pattern and Surface-treated Copper Foil thereof,申请号KR20040055382-传众专利搜索

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发明名称	Method of manufacturing Surface-treated Copper Foil for PCB having fine-circuit pattern and Surface-treated Copper Foil thereof
摘要
申请公布号	KR100654737(B1)	申请公布日期	2006.12.08
申请号	KR20040055382	申请日期	2004.07.16
申请人		发明人
分类号	H05K3/38	主分类号	H05K3/38
代理机构		代理人
主权项
地址

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