| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method wherein an occurrence of a warping caused by a mesa structure is restrained by an easier and universal method. SOLUTION: One or plurality of mesa structures of an external form having steep cliffs on both sides of a flat top are formed on both faces of an upper face 11b and a lower face 11a of a semiconductor substrate 11. A mesa structure (first mesa structure) 13 formed on the lower face 11a of the semiconductor substrate 11 is such a mesa structure that has a so-called element function in which an active layer 12 is a light emitting layer, and a mesa structure (second mesa structure) 23 formed on the upper face 11b of the semiconductor substrate 11 is a dummy mesa structure having no active layer. The second mesa structure 23 is provided in such a mode that the warping of the semiconductor substrate 11 caused by an arrangement of the first mesa structure 13 is dissolved and mitigated. COPYRIGHT: (C)2007,JPO&INPIT
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