| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for producing a coreless wiring board in which the surface of a substrate can be roughened easily, and to provide a coreless wiring board thus produced in which fluidity of underfill material is improved. <P>SOLUTION: In the process for producing a coreless wiring board, a multilayer sheet body SS (multilayer wiring portion L) is formed on a reinforcement substrate 3 by well-known built-up method, and then the multilayer wiring portion L is stripped from the reinforcement substrate 3 thus facilitating production. Since an adhesion Cu foil 4 having a surface roughened through Cu roughening is employed, a first dielectric layer B1 provided in tight contact therewith also has a surface (major surface MP1) of sufficient roughness. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
