| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be attempted to reduce an occurrence of a weld upon molding. SOLUTION: The semiconductor device 100 comprises a board 1 for laminating a plurality of semiconductor chips on the upper face; a first chip 2 disposed on the top of the laminated semiconductor chips on this board 1; a second chip 3 which has a larger area on the upper face than the first chip 2, and is disposed just under the first chip 2 so that the first chip 2 does not protrude from the upper face; a dummy chip 4 provided adjacent to the first chip 2 on the upper face of the second chip 3, so as not to protrude from the upper face of the second chip 3; and a sealing member 9 for sealing the board 1, the first chip 2, the second chip 3, and the dummy chip 4. COPYRIGHT: (C)2007,JPO&INPIT
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