| 摘要 |
A backdoor of semiconductor manufacture equipment is provided to improve a sealing between the backdoor and a doorframe by employing a magnetic material inserted into the doorframe. A doorframe(31) is arranged on a back panel of a housing. A magnetic material(37) is inserted into the doorframe. A door(35) is mounted on the doorframe. When the door is closed, at least parts of the magnetic material and the door are overlapped and at least part of a lower surface(35B) of the door is ranged over at least part of a lower portion of the doorframe. The doorframe is formed by bending a part of the back panel. The magnetic material is substantially arranged on the same surface as the doorframe. A hinge(36) mounts the door to the doorframe.
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