| 摘要 |
PURPOSE: A semiconductor multi-chip package and a fabricating method thereof are provided to fabricate the semiconductor multi-chip package by using an insulating structure and a lower chip having a center pad. CONSTITUTION: A plurality of connection terminals are arranged on an upper surface of a package substrate(200). The first chip(210) including the first bonding pads(215) is loaded on the upper surface of the package substrate. An insulating structure(260) is formed on the first chip. A bonding wire(230) is used for connecting one of the connection terminals to one of the first bonding pads. The second chip(310) including the second bonding pads is loaded on the insulating structure. |
