发明名称 METHOD OF MANUFACTURING METAL-CLAD POLYIMIDE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal-clad plastic substrate having a metal layer formed, by sputtering on a polyimide film surface which improves the adhesive strength of the metal layer made by sputtering to the metal film surface and the long-time stability under high-temperature environment. SOLUTION: The method of manufacturing a metal-clad plastic substrate, having a metal layer formed by sputtering on a polyimide film surface comprises treating the surface of the polyimide film surface with an alkali water solution of 0.001-10 mol/L concentration, prior to forming the metal layer, and then treating it with a polar organic solvent held at 20-40°C. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006324475(A) 申请公布日期 2006.11.30
申请号 JP20050146433 申请日期 2005.05.19
申请人 SUMITOMO METAL MINING CO LTD 发明人 OGASAWARA SHUICHI
分类号 H05K3/00;C23C14/20 主分类号 H05K3/00
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