Systems and methods for removing wafer edge residue and debris using a residue remover mechanism

摘要

A system ( 500 ) removes wafer edge residue from a target wafer ( 508 ). A wafer holding mechanism ( 502 ) holds and rotates the target wafer ( 508 ). A residue remover mechanism ( 504 ) mechanically interacts or abrades an edge surface of the target wafer ( 508 ) and removes strongly adhered residue from the edge surface of the target wafer ( 508 ). The residue remover mechanism ( 504 ) controls coverage of the mechanical interaction and magnitude of the mechanical interaction.