| 摘要 |
A semiconductor chip package having a lead-free plating layer on a lead is provided to prevent a conductive layer of an external lead from becoming a thin film in a solder reflow process by selectively forming a ceramic coating layer on the conductive layer. A package body(100) is prepared. An external lead(125) protrudes to the outside of the package body, including an upper part(125a) adjacent to the package body, a shoulder part(125b) that is extended from the upper part and has a predetermined inclination angle, and a soldering part(125c) extended from the shoulder part. A lead-free plating layer(155) is formed on the surface of the external lead. A ceramic coating layer(157) is formed on the plating layer, exposing the plating layer of the soldering part and including alumina or silica.
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