发明名称 |
Methods for fabricating fluid injection devices |
摘要 |
Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.
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申请公布号 |
US2006258138(A1) |
申请公布日期 |
2006.11.16 |
申请号 |
US20060355982 |
申请日期 |
2006.02.17 |
申请人 |
BENQ CORPORATION |
发明人 |
HU HUNG-SHENG;CHEN WEI-LIN;HSU TSUNG-PING;SHYN DER-RONG |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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