| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for preventing patterns from inclining in spin drying to remove moisture. SOLUTION: The method has the steps of forming a pattern made of a processed film or a resist on a substrate, washing the pattern with a washing liquid which is a liquid including at least water, spreading an amphophilic material that has a hydrophilic group and a hydrophobic group on the surface of the washing liquid remaining on the substrate after washing the pattern, and drying the substrate to remove the washing liquid on the substrate after spreading the amphophilic material. COPYRIGHT: (C)2007,JPO&INPIT |
