| 摘要 |
The present invention relates to an electret condenser microphone having a dual base structure wherein a metal ring and an insulation ring are bonded. The electret condenser microphone of the present invention comprises a casing (110) having a acoustic hole (112) at a bottom surface thereof, a vibrating plate (120) vibrating according to an acoustic pressure being input through the acoustic hole, the vibrating plate being electrically connected to the casing, a back electret plate (150) opposing the vibrating plate (120) having a spacer (130) therebetween, the back electret plate (150) including an electret consisting of a metal plate having a high molecule film adhered thereto, a back electret insulation ring for insulation the back electret plate from the casing, a dual base including a metal ring (162) for establishing an electrical connection for the back electret plate and an insulation ring (164) for forming a insulation space between the casing (110) and the metal ring (162), the metal ring having a shape of a spool wherein a center portion is concaved and end portions (162b) extrude, the insulation ring (164) surrounding the center portion and extruding with respect to the end portions of the metal ring, and a PCB (170) having a circuit mounted thereon, the PCB being supported by the metal ring of the dual base to form a back chamber with the back electret plate inside the microphone, wherein the metal ring supports the PCB when an end portion of the casing is curled after the vibrating plate, the back electret plate, the back electret insulation ring, the dual base are stacked in the casing. |
