| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which is capable of mounting semiconductor chips surely on a board while processes and materials necessary for carrying out the processes are markedly reduced and bonding a chip-side electrode and a board-side electrode together without using a lead-containing solder. <P>SOLUTION: A chip-side electrode 42 is selectively formed on the surface of a connection terminal 10a through an electroless plating method using a resist 40 as a mask for the formation of a semiconductor chip 48, and the semiconductor chip 48 is mounted on the board 50 bonding the chip-side electrode 42 and the board-side electrode 52 provided on the board 50 together and interposing the resist 40 between the semiconductor chip 48 and the board 50. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
